dicing Machine

High speed dicing is a cutting process using a circular dicing blade for precision cutting of very hard materials such as ceramic, glasses, tunston, … High precision cutting is usually a requirement when manufacturing electronic components such as high frequency components, chip capactors, chip inductors, … our expertise focuses especially around thick and hard ceramics such as PZT, MLCC, LTCC, …

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General Specification

Material size

up to 450x300mm

Thickness

0.05 ~ 55mm

Type

core drilling, angle dicing, milling, dicing, dual blade dicing

Accuracy

up to 0.001mm

Machines

 

Manual/Automatic loading dicing

MicroAce 66

Max. Work Capacity (X, Y, Z)
152mm x 152mm x 16mm

Blade Capacity
50.8mm – 76.2mm,
(101.6mm option available)

Spindle Options
1.8kW, 3,000 – 60,000rpm as standard, or 3.0kW 3,000 – 10,000 rpm

Chuck-type
Ceramic or metal vacuum

Dimensions
(W x D x H)

570mm x 1215mm x 1555mm

The MicroAce 66 is a 6” automatic dicing saw configured with a 2.4kW spindle as standard whilst other spindle set-ups are also available to suit a variety of applications including demanding and thick substrate cutting. The MicroAce 66 can be used for a wide range of applications, not just for dicing silicon wafers. It offers a high level of configurability to get the best performance out of your application.

Underpinning the MicroAce 66’s performance is the Loadpoint NanoControl control system; a common control platform used across all our machines. NanoControl uses a Loadpoint developed force-sensitive keypad with integrated tracker ball that provides a highly productive interface that is also robust for many years of service.

Another feature of NanoControl is that it can be developed bespoke to a customer’s application. This could involve taking the manual hassle out of calculating complex cut patterns or could involve easy generation of 3D cutting profiles.

NanoAce 3200

Max. Work Capacity (X, Y, Z)
200mm x 200mm x 13mm

Blade Capacity
50.8mm – 101.5mm

Spindle Options
1.8kW, 3,000 – 60,000rpm

Chuck-type
Ceramic or metal vacuum

Dimensions
(W x D x H)

1046mm x 1030mm x 2048mm (height includes traffic light)

The NanoAce 3200 is an 8” dicing saw that also finds many applications in larger area substrate cutting and dicing. The NanoAce 3200 is an automatic dicing saw with vision alignment system and high resolution closed loop linear positioning encoders in all axes where high performance tolerances are required. They offer a high level of configurability that allows the machine to be optimised to suit the application.

The performance of the NanoAce is underpinned by the Loadpoint NanoControl control system now fitted with user friendly touch screen interface.

NanoControl can be developed bespoke to a customer’s application. This could involve taking the manual hassle out of calculating complex cut patterns or could involve easy generation of 3D cutting profiles.

NanoAce 3300

Max. Work Capacity (X, Y, Z)
200mm x 200mm x 13mm

Blade Capacity
50.8mm – 101.5mm

Spindle Options
1.8kW, 3,000 – 60,000rpm as standard, or 2.4kW 3,000 – 60,000rpm

Chuck-type
Ceramic or metal vacuum

Dimensions
(W x D x H)

1046mm x 1030mm x 2048mm (height includes traffic light)

The NanoAce 3300 is a 12” dicing saw that also finds many applications in larger area substrate cutting and dicing. The NanoAce 3300 is an automatic dicing saw with vision alignment system and high resolution closed loop linear positioning encoders in all axes where high performance tolerances are required. They offer a high level of configurability that allows the machine to be optimised to suit the application.

The performance of the NanoAce is underpinned by the Loadpoint NanoControl control system now fitted with user friendly touch screen interface.

NanoControl can be developed bespoke to a customer’s application. This could involve taking the manual hassle out of calculating complex cut patterns or could involve easy generation of 3D cutting profiles.

 

Special Machines

MacroAce II

Max. Work Capacity (X, Y, Z)

Rotational Capacity, 305mm x 305mm x 55mm

Blade Capacity
100mm – 200mm (*55mm cut depth with 200mm dia. blade)

Spindle Options
3kW, 1,000 – 10,000rpm

Chuck-type
Ceramic or metal vacuum, mechanical vice, magnetic vice

Dimensions
(W x D x H)

1440mm x 1400mm x 2350mm (height includes traffic light)

MacroAce II for heavier duty applications requiring high power spindle delivery and large work areas. The MacroAce II offers a unique combination of dicing machine performance with CNC-like power and work area capability. The spindle’s drive profile has been optimised to give maximum 4KW power delivery in the 1,000 – 10,000rpm range, exactly where it is required for heavier duty ceramic & metal cutting applications. Additionally, cut depths of up to 55mm with cut lengths of up to 450mm help make the MacroAce II a best-in-class leader.

The MacroAce II is frequently the first-choice system for cutting bulk ceramics and lower frequency PZT sonar arrays. The performance of the MacroAce II is underpinned by the Loadpoint NanoControl control system; a common control platform used across all our machines. Another feature of NanoControl is that it can be developed bespoke to a customer’s application. This could involve taking the manual hassle out of calculating complex cut patterns or could involve easy generation of 3D cutting profiles.

MacroAce VS

Max. Work Capacity (X, Y, Z)

305 x 305 x 55mm, or with auto tool change 250 x 250 x 55mm

Spindle Options
3kw, 1,000 – 10,000 rev per min

Tooling
0.1mm – 50mm

Dimensions
(W x D x H)

1440mm x 1400mm x 2350mm (height includes traffic light)

The MacroAce II VS is a vertical spindle drilling system that can be used for core drilling, micro drilling and milling of a variety of substrates. The MacroAce II VS utilises an air bearing spindle to provide the best performance in regard to accuracy and quality of cut. Full automatic program control is achieved via Loadpoint’s own Nanocontrol System. Alternatively, for users who prefer a more CNC style interface, the MacroAce II VS can be fitted with control system.

With a positioning resolution of 0.001mm, even the most challenging specifications are achieved.

The MacroAce II VS has the flexibility for prototype trials and small batch runs but also has full functionality for high volume production work.