Cutting Machine

Dicing is a high speed cutting process with high accurate positioning by using circular dicing blade. High precious dicing is commonly applied in electronic component manufacturing industry.

Semi-Auto Dicing Mahine – 6 diameter

Semi-Auto Dicing Machine – 200mm / 300mm / 450mm diameter

Semi-Auto Drill or Core Drill System

Capacity

  • Work capacity: 152 mm dia (152 x 152 mm with special work holding
  • Blade capacity: 50 – 76.2mm dia
  • Up to 20mm thick components with 76.2mm blade

Vision and alignment system

Manual and automatic alignment modes:

  • Monocular video alignment system with pattern recognition
  • Pattern recognition System (PRS)
  • Alignment system with programmable off-set for off-cut alignment
  • Manual and automatic (option) kerf and chipping measurement on machine
  • Full 17” / 430 mm monitor for alignments, data entry and machine monitoring

Tooling

  • Standard wheel carrier with 50 to 76.2 mm diameter blade capacity
  • Three direction coolant delivery; main blade coolant jet, blade side wash bars and wafer flood jets
  • Accelerometer based Z datum set, off-chuck height sensing system

Work holding

  • Standard packages include adaptable plain wafer vacuum chuck for use with wax and substrate mounting and tape rings. Loadpoint manufacture chucks for all tape rings and film frames, mechanical vices, and designs to customer requirements, including precision-ground ceramic inserts for improved vacuum and component support

Capacity

  • X,Y,Z = 450 x 300 x 13mm
  • Continuous rotation theta axis
  • 50 – 76.2mm, hubbed and hubless (100mm / 4”blade option available for 16mm thick work piece capability)

Vision and alignment system

Manual and automatic alignment modes:

  • Pattern Recognition System (PRS)
  • 2 point alignment with programmable off-set for off-cut alignment
  • Manual and automatic (option) kerf and chipping measurement
  • 17” LCD monitor

System Productivity

  • Off-chuck height sensing system ensures constant depth of cut, blade dressing routines add consistency of cut, BBD (broken blade detection) minimizes machine downtime.

Work holding

  • Standard packages include adaptable plain wafer chuck for use with wax and substrate mounting systems and film frames. Loadpoint also manufacture standard and custom chucks for all standard tape ring and film frame mounting systems, with optional ceramic inserts for improved component support. Other custom designs inc. tape defined vacuum channels, mechanical vices, and designs to customer requirements

Capacity

  • X,Y,Z = 250 x 250 x 20mm
  • Options for heavy duty application increase Z capacity to 40m

Vision and alignment system

Manual and automatic alignment modes:

  • Pattern Recognition System (PRS)
  • 2 point automatic work piece alignment
  • Monocular video alignment system
  • 17” LCD monitor
  • Options with Heidenhain TNC320 Control System, CNC style programming, with full 3D capability

Tooling

  • Collet with 10mm shank capacity
  • Accelerometer based sealed Z datum set off-chuck height sensing system

Full Process Control

  • Achieve full control of process by using Loadpoint core-drills
  • Develop and manufacture bespoke drills optimized for customer application
  • Core drill can be machined with a high tolerance specification suitable for even the most demanding micro machining applications